Processors

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Processor package size: 76 x 56.5 mm

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Processor package size: 76 x 56.5 mm

Lenovo Intel Xeon Gold 6130. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SN550

AMD EPYC 7F32. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

Intel Xeon E7420. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm

AMD Opteron Dual-core 8220 SE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron Dual-Core 8220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Cisco E5-2640V3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX. Processor package size: 52.5 mm

AMD Opteron Dual-Core 8220. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

Lenovo Intel Xeon Silver 4116. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR650

Lenovo Intel Xeon Gold 6134. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR650

AMD EPYC Embedded 7302. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Embedded. USB version: 3.2 Gen 1 (3.1 Gen 1)

Cisco Intel Xeon E5-2640 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Cisco Intel Xeon E5-2640 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Intel Xeon Gold 5415+. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR5-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® QuickAssist Technology (QAT): 1 default devices, Intel® Dynamic Load Balancer (DLB): 1 default devices. Package type: Retail box

Intel Xeon Gold 5416S. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR5-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 128 GB, Intel® QuickAssist Technology (QAT): 2 default devices, Intel® Dynamic Load Balancer (DLB): 2 default devices. Processor package size: 77.5 x 56.5 mm

AMD EPYC 7343. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

AMD Opteron 6380. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.768 MB, Temperature (max): 69 °C