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Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND1
Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND1 Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND2

Transcend MTS952T2 M.2 512 GB Serial ATA III 3D NAND

Transcend MTS952T2. SSD capacity: 512 GB, SSD form factor: M.2, Read speed: 560 MB/s, Write speed: 520 MB/s, Data transfer rate: 6 Gbit/s, Component for: PC
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Manufacturer: Transcend
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 6178278
Manufacturer part number: TS512GMTS952T2
$113.43
Transcend's MTS952T2 M.2 SSD features the SATA III 6Gb/s interface, delivering superior transfer speeds. The MTS952T2 features the latest 3D NAND technology for high storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.

 

  • DRAM Cache embedded
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • 30µ" PCB gold finger
  • Key components fortified by default with Corner Bond technology
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Dynamic Thermal Throttling
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Enhanced S.M.A.R.T. function for durability
Transcend's MTS952T2 M.2 SSD features the SATA III 6Gb/s interface, delivering superior transfer speeds. The MTS952T2 features the latest 3D NAND technology for high storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.

 

  • DRAM Cache embedded
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • 30µ" PCB gold finger
  • Key components fortified by default with Corner Bond technology
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Dynamic Thermal Throttling
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Enhanced S.M.A.R.T. function for durability
Products specifications
Attribute nameAttribute value
Depth0.141"
Weight0.317 oz
DevSlp (device sleep) supportY
Design
CertificationCE, FCC, BSMI
Features
Write speed520 MB/s
Random write (4KB)85000 IOPS
Power
Power consumption (sleep)0.4 W
Operational conditions
Minimum operating temperatureEmbedded
Maximum operating temperaturex4
Operating temperature (T-T)-20 - 75 °C
Operating vibration20 G
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Products specifications
Attribute nameAttribute value
Depth0.141"
Weight0.317 oz
DevSlp (device sleep) supportY
Design
CertificationCE, FCC, BSMI
Features
Write speed520 MB/s
Random write (4KB)85000 IOPS
Power
Power consumption (sleep)0.4 W
Operational conditions
Minimum operating temperatureEmbedded
Maximum operating temperaturex4
Operating temperature (T-T)-20 - 75 °C
Operating vibration20 G
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