Intel BBS7200APL motherboard Intel® C612 LGA 3647 (Socket P)

Intel BBS7200APL. Processor manufacturer: Intel, Processor socket: LGA 3647 (Socket P), Compatible processor series: Intel® Xeon Phi™. Supported memory types: DDR4-SDRAM, Maximum internal memory: 384 GB, Memory channels: Hexa-channel. Ethernet interface type: Gigabit Ethernet. Component for: Server, Motherboard chipset: Intel® C612, Market segment: Server. Width: 6.8" (172.7 mm), Depth: 14.2" (360.7 mm)
Manufacturer: Intel
SKU: 4974060
Manufacturer part number: BBS7200APL
UPC: 5032037090124
$969.89
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Quiet Thermal Technology
Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Build Assurance Technology
Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology
Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Fast Memory Access
Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology
Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® I/O Acceleration Technology
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Quiet Thermal Technology
Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Build Assurance Technology
Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology
Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Fast Memory Access
Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology
Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® I/O Acceleration Technology
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Products specifications

Attribute name Attribute value
Product series Intel® Server Board S7200AP Family
Packaging content (10) Intel Server Board S7200APL
Additional information URL http://www.intel.com/content/www/us/en/support/server-products/server-boards/single-socket-server-boards/intel-server-board-s7200ap-family.html
Supported RAID configuration Intel® Embedded Server RAID Technology (ESRT2)
Motherboard ARK ID 95779
Maximum Memory 384 GB
Maximum internal memory 2 x 16 GB
Memory bandwidth (max) 512 GB/s
Product family Single-socket server board
Commodity Classification Automated Tracking System (CCATS) G074226+
Number of SATA connectors 1
Launch date Q2'16
Product codename Adams Pass
Number of DIMM slots 6
Intel Xeon series Phi
Intel Remote Management Module Support Y
Expected discontinuance date Q2'18
End of life date announce Monday, April 30, 2018
Last order date Sunday, September 30, 2018
Last receipt attributes date Sunday, December 30, 2018
Graphics output Internal RGB Video Header
Riser slot 1 number of lanes 16
Riser slot 2 number of lanes 16
Width 6.8"
Depth 14.2"
Motherboard chipset Intel® C612
Harmonized System (HS) code 8473301180
Market segment Server
Last change 63903513
Processor manufacturer Intel
Total number of SATA connectors 1
PCI Express x16 (Gen 3.x) slots 2
Status Discontinued
Export Control Classification Number (ECCN) 5A992CN3
Supported memory types DDR4-SDRAM
Number of processors supported 1
Trusted Platform Module (TPM) version 2.0
PCI Express CEM revision 3.0
On-board graphics card Yes
Trusted Platform Module (TPM) Yes
PCI Express x8 (Gen 3.x) slots 0
Processor number of cores supported 64, 68
PCI Express x8 (Gen 2.x) slots 0
PCI Express x16 (Gen 2.x) slots 0
Intel Intelligent Power Node Manager Yes
Intel Server Management Software Yes
Rack-Friendly board Yes
Intel Node Manager Yes
Intel Advanced Management Technology Yes
Intel Rapid Storage Technology enterprise Yes
Intel Build Assurance Technology Yes
Intel Quiet Thermal Technology Yes
Intel Efficient Power Technology Yes
Intel Server Customization Technology Yes
Intel I/O Acceleration Technology Yes
Integrated systems available No
Intel Quiet System Technology (QST) Yes
Intel Quick Resume Technology Yes
ECC сompatibility ECC
Design
Form factor Custom 6.8" x 14.2"
Chassis type Rack (2)
Features
Product type Server/Workstation Board
Memory channels Hexa-channel
Component for Server
ECC Y
Performance
Compatible processor series Intel® Xeon Phi™
Ethernet LAN Yes
Ports & interfaces
Ethernet LAN (RJ-45) ports 2
USB ports quantity 2
Serial ports quantity 1
USB version 3.2 Gen 1 (3.1 Gen 1)
VGA (D-Sub) ports quantity 1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
USB 2.0 ports quantity 0
PS/2 ports quantity 0
Network
Ethernet interface type Gigabit Ethernet
Wi-Fi No
Processor
Thermal Design Power (TDP) 215 W
Maximum internal memory supported by processor 384 GB
Memory bandwidth supported by processor (max) 512 GB/s
CPU configuration (max) 1
PCI Express slots version 3.0
Processor socket LGA 3647 (Socket P)
ECC supported by processor Yes
Processor special features
Maximum number of PCI Express lanes 32
Embedded options available No
Intel Fast Memory Access Yes
Intel Flex Memory Access Yes
Intel Trusted Execution Technology Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
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Products specifications

Attribute name Attribute value
Product series Intel® Server Board S7200AP Family
Packaging content (10) Intel Server Board S7200APL
Additional information URL http://www.intel.com/content/www/us/en/support/server-products/server-boards/single-socket-server-boards/intel-server-board-s7200ap-family.html
Supported RAID configuration Intel® Embedded Server RAID Technology (ESRT2)
Motherboard ARK ID 95779
Maximum Memory 384 GB
Maximum internal memory 2 x 16 GB
Memory bandwidth (max) 512 GB/s
Product family Single-socket server board
Commodity Classification Automated Tracking System (CCATS) G074226+
Number of SATA connectors 1
Launch date Q2'16
Product codename Adams Pass
Number of DIMM slots 6
Intel Xeon series Phi
Intel Remote Management Module Support Y
Expected discontinuance date Q2'18
End of life date announce Monday, April 30, 2018
Last order date Sunday, September 30, 2018
Last receipt attributes date Sunday, December 30, 2018
Graphics output Internal RGB Video Header
Riser slot 1 number of lanes 16
Riser slot 2 number of lanes 16
Width 6.8"
Depth 14.2"
Motherboard chipset Intel® C612
Harmonized System (HS) code 8473301180
Market segment Server
Last change 63903513
Processor manufacturer Intel
Total number of SATA connectors 1
PCI Express x16 (Gen 3.x) slots 2
Status Discontinued
Export Control Classification Number (ECCN) 5A992CN3
Supported memory types DDR4-SDRAM
Number of processors supported 1
Trusted Platform Module (TPM) version 2.0
PCI Express CEM revision 3.0
On-board graphics card Yes
Trusted Platform Module (TPM) Yes
PCI Express x8 (Gen 3.x) slots 0
Processor number of cores supported 64, 68
PCI Express x8 (Gen 2.x) slots 0
PCI Express x16 (Gen 2.x) slots 0
Intel Intelligent Power Node Manager Yes
Intel Server Management Software Yes
Rack-Friendly board Yes
Intel Node Manager Yes
Intel Advanced Management Technology Yes
Intel Rapid Storage Technology enterprise Yes
Intel Build Assurance Technology Yes
Intel Quiet Thermal Technology Yes
Intel Efficient Power Technology Yes
Intel Server Customization Technology Yes
Intel I/O Acceleration Technology Yes
Integrated systems available No
Intel Quiet System Technology (QST) Yes
Intel Quick Resume Technology Yes
ECC сompatibility ECC
Design
Form factor Custom 6.8" x 14.2"
Chassis type Rack (2)
Features
Product type Server/Workstation Board
Memory channels Hexa-channel
Component for Server
ECC Y
Performance
Compatible processor series Intel® Xeon Phi™
Ethernet LAN Yes
Ports & interfaces
Ethernet LAN (RJ-45) ports 2
USB ports quantity 2
Serial ports quantity 1
USB version 3.2 Gen 1 (3.1 Gen 1)
VGA (D-Sub) ports quantity 1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
USB 2.0 ports quantity 0
PS/2 ports quantity 0
Network
Ethernet interface type Gigabit Ethernet
Wi-Fi No
Processor
Thermal Design Power (TDP) 215 W
Maximum internal memory supported by processor 384 GB
Memory bandwidth supported by processor (max) 512 GB/s
CPU configuration (max) 1
PCI Express slots version 3.0
Processor socket LGA 3647 (Socket P)
ECC supported by processor Yes
Processor special features
Maximum number of PCI Express lanes 32
Embedded options available No
Intel Fast Memory Access Yes
Intel Flex Memory Access Yes
Intel Trusted Execution Technology Yes
Intel® AES New Instructions (Intel® AES-NI) Yes

Product tags

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