Axiom AXG101626 memory module 32 GB 1 x 32 GB DDR4 3200 MHz ECC

Axiom AXG101626. Component for: PC/server, Internal memory: 32 GB, Memory layout (modules x size): 1 x 32 GB, Internal memory type: DDR4, Memory clock speed: 3200 MHz, Memory form factor: 288-pin DIMM, CAS latency: 22, ECC
Manufacturer: Axiom
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 8882954
Manufacturer part number: AXG101626
UPC: 198105000558
MSRP: $557.00
$242.78
Axiom's DDR4 provides improved speed, power management and reliability over previous DDR generations. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.

High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.

 

  • 100% Increase in speed - Faster Data Rate equates to more responsive application loads on data-intensive programs
  • 300% increase in component densities – Equals larger modules for next-generation performance demands
  • 20% decrease in power consumption – Less power consumed means less wasted resources to cool systems and reserves battery program for mobile devices
  • Provides greater reliability, availability and serviceability (RAS) in enterprise applications – Complete integrity and fault tolerance for longer periods without system failure
  • Improved data signal
Axiom's DDR4 provides improved speed, power management and reliability over previous DDR generations. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3.

High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade.

 

  • 100% Increase in speed - Faster Data Rate equates to more responsive application loads on data-intensive programs
  • 300% increase in component densities – Equals larger modules for next-generation performance demands
  • 20% decrease in power consumption – Less power consumed means less wasted resources to cool systems and reserves battery program for mobile devices
  • Provides greater reliability, availability and serviceability (RAS) in enterprise applications – Complete integrity and fault tolerance for longer periods without system failure
  • Improved data signal
Products specifications
Attribute nameAttribute value
Compliance certificatesRoHS, Trade Agreements Act (TAA)
Technical details
Sustainability complianceYes
Features
Internal memory32 GB
Internal memory typeDDR4
Memory clock speed3200 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCYes
Buffered memory typeRegistered (buffered)
CAS latency22
Memory voltage1.2 V
Memory layout (modules x size)1 x 32 GB
Module configuration2048M x 4
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Products specifications
Attribute nameAttribute value
Compliance certificatesRoHS, Trade Agreements Act (TAA)
Technical details
Sustainability complianceYes
Features
Internal memory32 GB
Internal memory typeDDR4
Memory clock speed3200 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCYes
Buffered memory typeRegistered (buffered)
CAS latency22
Memory voltage1.2 V
Memory layout (modules x size)1 x 32 GB
Module configuration2048M x 4