Thermaltake TG-4 heat sink compound 3.3 W/m·K 0.0529 oz (1.5 g)1

Thermaltake TG-4 heat sink compound 3.3 W/m·K 0.0529 oz (1.5 g)

Thermaltake TG-4. Thermal conductivity: 3.3 W/m·K, Product color: Gray, Operating temperature (T-T): -50 - 250 °C. Width: 2.8" (71 mm), Depth: 0.642" (16.3 mm), Height: 4.74" (120.5 mm)

Manufacturer: Thermaltake

SKU: 3796026

Manufacturer part number: CL-O001-GROSGM-A

UPC: 4717964392435

MSRP: $6.99

Price: $5.29

Qty:

Thermaltake high performance and exceptional reliability Thermal grease, to maximize heat transfer by eliminating the minuite air gap between the heat source and the heat sink caused by their irregular surfaces.

High Thermal Conductivity
Lighter, easier to spread stable composition won’t crack or dry out, delivering excellent long-lasting thermal conductivity.

High Fluidity
Producing an even layer with high fluidity when using applicator.

Long life span
More effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage for a long life span usage.

Made for Extreme Performance
TG-4 is optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

Easy to use
Easy to use on the contact surface of the heatsink to improve the heat dissipation of the processor

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Products specifications

Attribute name	Attribute value
Height	4.74"
Weight	0.0529 oz
Thermal conductivity	3.3 W/m·K
Width	2.8"
Depth	0.642"
Technical details
Product color	Gray
Operational conditions
Operating temperature (T-T)	-50 - 250 °C

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Products specifications

Attribute name	Attribute value
Height	4.74"
Weight	0.0529 oz
Thermal conductivity	3.3 W/m·K
Width	2.8"
Depth	0.642"
Technical details
Product color	Gray
Operational conditions
Operating temperature (T-T)	-50 - 250 °C

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