Kingston Technology KSM32ES8/16MF memory module 16 GB 1 x 16 GB DDR4 3200 MHz ECC

Kingston Technology KSM32ES8/16MF. Component for: PC/server, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory clock speed: 3200 MHz, Memory form factor: 288-pin DIMM, CAS latency: 22, ECC
Manufacturer: Kingston Technology
SKU: 6671329
Manufacturer part number: KSM32ES8/16MF
UPC: 0740617328387
MSRP: $96.00
$76.14
Kingston's KSM32ES8/16MF is a 2G x 72-bit (16GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module, based on nine 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

 

  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • Temperature sensor with integrated SPD
  • 16 internal banks; 4 groups of 4 banks each
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
Kingston's KSM32ES8/16MF is a 2G x 72-bit (16GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module, based on nine 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

 

  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • Temperature sensor with integrated SPD
  • 16 internal banks; 4 groups of 4 banks each
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
Products specifications
Attribute nameAttribute value
Height1.23"
Width5.25"
JEDEC standardY
Lead platingGold
Doesn't containHalogen
Harmonized System (HS) code84733020
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
SPD profileY
Programming power voltage (VPP)2.5 V
Technical details
Sustainability certificatesRoHS
Features
Internal memory16 GB
Internal memory typeDDR4
Memory clock speed3200 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCY
Buffered memory typeUnregistered (unbuffered)
CAS latency22
Memory voltage1.2 V
Memory layout (modules x size)1 x 16 GB
Memory ranking1
Module configuration2048M x 72
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
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Products specifications
Attribute nameAttribute value
Height1.23"
Width5.25"
JEDEC standardY
Lead platingGold
Doesn't containHalogen
Harmonized System (HS) code84733020
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
SPD profileY
Programming power voltage (VPP)2.5 V
Technical details
Sustainability certificatesRoHS
Features
Internal memory16 GB
Internal memory typeDDR4
Memory clock speed3200 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCY
Buffered memory typeUnregistered (unbuffered)
CAS latency22
Memory voltage1.2 V
Memory layout (modules x size)1 x 16 GB
Memory ranking1
Module configuration2048M x 72
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Product tags
  • (55039)