AMD Opteron Dual-core 8222 SE processor 3 GHz 1 MB L2

AMD Opteron Dual-core 8222 SE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB
Manufacturer: AMD
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 1832641
Manufacturer part number: OSY8222GAA6CY
$2,077.19
The AMD Opteron™ processor helps enable a breakthrough in high-performance, low power processing for edge-of-enterprise markets including storage and telecommunications, as well as more traditional embedded markets such as security and medical imaging, military systems, and single-board computing. AMD64 technology with Direct Connect Architecture helps provide a balanced foundation for embedded systems. Based on the industry-standard x86 platform, AMD64 delivers the right match of processing power, memory performance, I/O throughput, and scalability. Add the vision of 32- and 64-bit application support with native multi-core computing in a consistent thermal envelope and many embedded designers are finding their AMD Opteron™ processor-based next-generation systems deliver superior application performance. - HyperTransport™ technology provides up to 17.6GB/s per link in HT 3.0 generation, and is compatible with HT 1.0 generation implementation. - On-die integrated DDR2 memory controller offers available memory bandwidth up to 12.8GB/s (with DDR2-800) per processor. - Hardware assisted AMD Virtualization™ technology in AMD Opteron processors with DDR2 helps streamline the efficiency of multiple servers and provides virtual machine memory isolation for improved security. - Socket F (1207) provides system upgrade option from dualcore to quad-core in the same physical foorprint with future upgrade to six-core when they become available.
The AMD Opteron™ processor helps enable a breakthrough in high-performance, low power processing for edge-of-enterprise markets including storage and telecommunications, as well as more traditional embedded markets such as security and medical imaging, military systems, and single-board computing. AMD64 technology with Direct Connect Architecture helps provide a balanced foundation for embedded systems. Based on the industry-standard x86 platform, AMD64 delivers the right match of processing power, memory performance, I/O throughput, and scalability. Add the vision of 32- and 64-bit application support with native multi-core computing in a consistent thermal envelope and many embedded designers are finding their AMD Opteron™ processor-based next-generation systems deliver superior application performance. - HyperTransport™ technology provides up to 17.6GB/s per link in HT 3.0 generation, and is compatible with HT 1.0 generation implementation. - On-die integrated DDR2 memory controller offers available memory bandwidth up to 12.8GB/s (with DDR2-800) per processor. - Hardware assisted AMD Virtualization™ technology in AMD Opteron processors with DDR2 helps streamline the efficiency of multiple servers and provides virtual machine memory isolation for improved security. - Socket F (1207) provides system upgrade option from dualcore to quad-core in the same physical foorprint with future upgrade to six-core when they become available.
Products specifications
Attribute nameAttribute value
Processor front side bus1000 MHz
Processor core voltage (AC)1.325/1.375 V
L2 cache speed3 GHz
L1 cache0.125 MB
Processor base frequency3 GHz
BoxN
Operational conditions
Maximum operating temperature69 °C
Processor
Processor familyAMD Opteron
Processor socketSocket F (1207)
SteppingF3
Thermal Design Power (TDP)119 W
Processor lithography90 nm
Processor manufacturerAMD
Processor cores2
Processor cache1 MB
Processor cache typeL2
Processor operating modes64-bit
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Products specifications
Attribute nameAttribute value
Processor front side bus1000 MHz
Processor core voltage (AC)1.325/1.375 V
L2 cache speed3 GHz
L1 cache0.125 MB
Processor base frequency3 GHz
BoxN
Operational conditions
Maximum operating temperature69 °C
Processor
Processor familyAMD Opteron
Processor socketSocket F (1207)
SteppingF3
Thermal Design Power (TDP)119 W
Processor lithography90 nm
Processor manufacturerAMD
Processor cores2
Processor cache1 MB
Processor cache typeL2
Processor operating modes64-bit
Product tags
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